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電子加工行業(yè)的主體SMT貼片加工廠，不管是一站式服務(wù)商還是純SMT貼片廠家。SMT貼片加工必然要考慮工藝的管控。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
SMT工藝從表面上來講需要，元器件貼裝整齊、元器件與焊盤正中、不偏不移，深層次的品質(zhì)要求需要沒有錯(cuò)、漏、反、虛、假焊等。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
具體上來講，每一個(gè)焊盤對(duì)應(yīng)的元器件已經(jīng)是設(shè)計(jì)之初都定下來的，元器件與Gerber資料的貼片數(shù)據(jù)要對(duì)應(yīng)，規(guī)格型號(hào)要正確，元器件的正反也影響著產(chǎn)品的正常與否，例如，絲印層的正反就決定了設(shè)計(jì)的功能指標(biāo)能否實(shí)現(xiàn)。特別是(二極管、三極管、鉭質(zhì)電容)這些，正反就決定了功能的實(shí)現(xiàn)與否。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
BGA、IC元器件的多引腳和復(fù)雜性，決定了它對(duì)品質(zhì)的要求非常高，焊點(diǎn)連錫、橋連，BGA焊接一定需要X-RAY進(jìn)行檢驗(yàn)。另外焊盤的錫珠、錫渣殘留量也影響著產(chǎn)品的質(zhì)量。工藝管控需要重點(diǎn)關(guān)注。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
在smt工廠的品質(zhì)總結(jié)會(huì)議上，經(jīng)常會(huì)聽到錯(cuò)、漏、反、虛、假焊等詞眼，毋庸置疑，SMT貼片加工相關(guān)不良項(xiàng)目的定義與此關(guān)系密切，下面我們一起來看看吧！<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
1、漏焊：即開焊，包括焊接或焊盤與基板表面分離。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
2、錯(cuò)焊：上料不準(zhǔn)，元器件的料號(hào)與實(shí)際設(shè)計(jì)物料不匹配。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
3、虛焊：焊接后，焊端或引腳與焊盤之間有時(shí)出現(xiàn)電隔離現(xiàn)象。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
4、立碑：即墓碑，元器件的焊端離開焊盤向上方斜立或直立。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
5、移位：元器件貼裝中與焊盤位置不一致，便宜焊盤。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
6、拖尾拉絲：焊料有突出向外的毛刺，沒有與其他導(dǎo)體相連，或者錯(cuò)連，而引發(fā)短路等其他原因。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
7、反：物料貼反，由于現(xiàn)在的產(chǎn)品越來越多的追求小型化，智能化。相對(duì)于物料就越來越小，01005/0201元器件越來越多的出現(xiàn)，反貼也時(shí)常出現(xiàn)。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
8、少錫：錫量太少，導(dǎo)致焊點(diǎn)容易脫落和虛焊。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
9、殘留：相對(duì)于少錫，焊膏殘留也是需要注意的，過多的錫珠、錫渣殘留會(huì)在某種工況下導(dǎo)致短路等品質(zhì)問題。<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
以上是百千成smt工廠為您提供的行業(yè)咨詢，希望對(duì)您有所幫助！<p style="margin: 0px 0px 15px; padding: 0px; word-spacing: -1.5px; line-height: 25px; text-indent: 24px; font-family: "Microsoft Yahei"; text-align: justify;">
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